Chemical mechanical planarization (CMP) removes material from the surface of a wafer to achieve a high-quality foundation for the next layer of a circuit or as a final polishing step. Our next-generation CMP silica sol abrasives are designed to enable targeted selectivity, low defectivity and scratch rate, fast removal rate and high stability in slurry formulation.
We offer a range of colloidal silica abrasives for CMP to cover different slurry needs for different chip types and layers. The abrasive particles have a size distribution, hardness, morphology and surface profile which directly affect critical metrics, including removal rate and wafer defects.
Our experienced dedicated RD&E teams provide customized silica sol product development to deliver solutions that are tailored to specific business needs and processes. We design products covering a wide range of:
Colloidal Silica Product Quality and Consistency
Nalco Water focuses on quality, consistency, and reliability throughout all our colloidal silica solutions. To ensure that our silica sol performs correctly in CMP applications, we look to IPC standards to guide our quality control testing.
References
With unparalleled expertise and cutting-edge technology, we partner with customers to deliver world-class results and optimized operations. Contact us to learn how we can help you.
Ecolab Inc.
1 Ecolab Place
St. Paul, MN 55102
Ecolab Customer Service:
Phone: +1-800-352-5326
Nalco Water Customer Service
Phone: +1-800-288-0879
With unparalleled expertise and cutting-edge technology, we partner with customers to deliver world-class results and optimized operations. Contact us to learn how we can help you.
Ecolab Inc.
1 Ecolab Place
St. Paul, MN 55102
Ecolab Customer Service
Phone: +1-800-352-5326
Nalco Water Customer Service
Phone: +1-800-288-0879
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